3-D Tour of Integrated Circuits at the Nanometer Scale

Posted in Journal Articles on March 30, 2018 at 9:30 pm by JCCMP

High-resolution non-destructive three-dimensional imaging of integrated circuits
Authors: Mirko Holler, Manuel Guizar-Sicairos, Esther H. R. Tsai, Roberto Dinapoli, Elisabeth Müller, Oliver Bunk, Jörg Raabe, and Gabriel Aeppli
Nature 543, 402 (2017)

Recommended with a commentary by J. B. Hastings, SLAC National Accelerator Laboratory.
|View Commentary|

DOI: 10.36471/JCCM_March_2018_03
https://doi.org/10.36471/JCCM_March_2018_03

Guidelines for Comments by Members:
Members are invited to comment on the chosen papers and refer only to papers intimately related to the papers selected. Other comments and suggestions can be transmitted to the organizers through the 'Guest book' link. These comments will be put on the web-site and the archives so that they can be read by other members. Just as in the Guidelines to the Corresponding Members, we suggest that the comments be confined to substantive issues of science and in order to illuminate the subject matter. A collegial and respectful tone is suggested. Issues of priority should not be raised in the comments.

Leave Your Comment Below

Your email address will not be published. Required fields are marked *

This site uses Akismet to reduce spam. Learn how your comment data is processed.

google

google